Fund Description :
This award recognizes the best “Vision of the Future of Electronics Packaging” abstract, to be presented at the IEEE Electronic Components and Technology Conference (ECTC) during the Tuesday evening panel session.
Fund Value :
Prize: Up to three awards will be provided to an individual or team. The prize will be $500 for each winner (if one of the winners is a team, $500 will be awarded to each member of the team). Travel grants will be provided to attend ECTC, and applied toward actual travel expenses including airfare, hotel and meals. Up to $1,000 for US based winners and up to $1,500 for Non US winners. Proof of travel expenses including receipts will need to be submitted for the reimbursements to be dispersed. Travel funding can be used for an individual or shared among the team (Total funding $1,000 per US team; Total funding $1,500 per Non US team). One complimentary conference registration to attend ECTC will be provided (one per team).
Additional Eligibility :
Presented to: An individual or a team of not more than three.
Eligibility: All ECTC and ITherm attendees are eligible. Winners are required to present their packaging visions at the ECTC Tuesday evening Panel Session.
Apply Instructions :
Submit An Abstract
EPS Packaging Vision Competition
This Student Fund is a :
Awards
Sponsored By :
IEEE Electronics Packaging Society